Professional active cooling doesn’t start with a fan.
It starts with raw aluminum—and a system-level approach to heat.
For Z Box, we use an industrial-grade active cooling system. From material selection and machining to drilling, assembly, and airflow testing, every step is completed in certified factories. This cooling solution is designed specifically for our Android motherboard—no compromises.
1. Why We Insist on a Custom Cooling Solution
Under heavy load, an Android motherboard can draw 18–20W of power, far more than typical ARM devices.
From day one, we made a clear decision:
cooling could not be an afterthought.
Instead of simply attaching a fan, we designed the thermal system across four levels:
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Material
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Structure
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Power
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Airflow
Only by addressing all four together can we ensure stable performance under sustained load.
2. Starting With Aluminum: Not Just Any Metal Block
We work with a professional industrial aluminum manufacturer in Shenzhen, using 6063-T5 high-thermal-conductivity aluminum.
Each heatsink is:
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Precisely cut to 65 × 110 × 12 mm
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CNC-machined and anodized for corrosion resistance and even heat dissipation
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Drilled and shaped based on the motherboard’s heat concentration zones
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Pre-designed with dedicated mounting points for both the board and the fan
This is not an off-the-shelf part.
It’s a custom module built specifically for the Z Box enclosure and layout.
3. Fan & Airflow Design: Airflow Is About Direction, Not Just Force
We tested seven different fan models before settling on the final solution:
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50 mm diameter, 10 mm thickness, 5V power
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Low power consumption, high static pressure
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Ultra-low noise profile
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Fully aligned with the aluminum heatsink base
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Plug-and-play, rated for over 10,000 hours of operation
The fan is mounted on the inner side of the heatsink and paired with a high-conductivity thermal pad between the heatsink and motherboard.
Air is drawn in from the bottom and exhausted from the side, forming a closed airflow loop that efficiently carries heat away from the system’s core components—significantly reducing operating temperatures.
4. Assembly & Testing: Every Cooling Module Is Verified
Each cooling module is fully assembled and tested at the factory before final installation.
Testing includes:
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Structural checks: clearance inside the enclosure and screw alignment
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Fan performance tests: stable RPM and safe power delivery
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Thermal contact verification: flat contact and proper pressure on thermal pads
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Temperature monitoring: real-world operation for 5 minutes to confirm temperatures stay within target limits under load
What you see is a small box quietly moving air.
What you don’t see is an entire industrial cooling process ensuring it runs cool, stable, and silent.
More Z Box product details in here